Electrical Measurement of Ferroelectric Properties
Piezoelectric Resonance
Direct Piezoelectric Measurement – The Berlincourt Method
Pyroelectric Materials
Interferometry for piezoelectric materials and films
Temperature dependence of piezoelectrics
Measurement and Modelling of Self-Heating in Piezoelectric Materials and Devices
- Ultrasonic Cleaning
- Ultrasonic Welding
- Sonar Transducers
- Diesel Injectors
- Ultrasonic Sewage Treatment
all use piezoelectric materials operated at high drive levels, where thermal loading on the device becomes an issue, and where potentially expensive cooling is needed to maintain device performance. When piezoelectric materials are used as actuators they make use of the indirect piezoelectric effect, where the application of an electric field gives rise to an internal strain. In this solid-state energy transformation there will always be a balance between electrical energy input and work done by the device. The coupling coefficient, k, is used to describe this efficiency for an ideal case where there are no losses. Here, k is essentially the ratio of the open circuit compliance to the short circuit compliance. For most real piezoelectric materials this conversion process is also associated with losses – both mechanical and dielectric. These losses manifest themselves in the form of heat, causing a temperature rise in the device, which, depending on the thermal boundary conditions can be detrimental to device performance. This self-heating effect is most often encountered in resistive components and is termed ‘Joule Heating’. However, it is also seen in non-ideal dielectric materials where the dielectric loss gives rise to internal heat generation. To a first approximation, piezoelectric actuators can be thought of as a non-ideal or lossy dielectric but, because the material is moving, additional mechanical terms are needed to model this behaviour. If the energy loss to the surroundings is greater than the internal power generation, then the sample will eventually reach an equilibrium temperature. If the sample losses are greater than those to the environment, or if the losses increase with increasing temperature, then the sample will heat up until some catastrophic event is reached – such as the soldered connections failing, softening of adhesives, or depolarisation of the material.
Piezoresponse Force Micropscopy – PFM
Indentation Stiffness Analysis of Ferroelectric Thin Films
It is now relevant to discuss losses prevalent in piezoelectric ceramic compositions since these values are often as important as the functional, dielectric and elastic constants that resonance analysis yields. In reality, a piezoelectric material comprises losses originating from its dielectric response to an electrical field, mechanical response to applied stress or following piezoelectric motion and its piezoelectric (strain) response to an electric field. The impact of these losses on a resonance sweep is a reactive and resistive part to the measured impedance. A material with zero losses would exhibit zero impedance at resonance. The significance of loss results in sample heating or noise production and this is why for many applications an understanding of loss mechanisms and absolute values becomes important. Normally, the mechanical loss at resonance is calculated from the width of the resonant peak and is labelled the mechanical Q or Quality factor. The narrower the resonant peak, the higher its Q. Dielectric losses are normally calculated from the phase angle between observed capacitance and applied field, labelled tan(delta). Piezoelectric loss may not normally be calculated from resonance data but may be assessed through strain – electric field response whereby any hysteresis present may be tentatively ascribed to this loss alone – of course, if strain is produced then mechanical loss may also have an additive effect. This issue is contentious and discussed in this chapter.